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Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd

Non-magnetic Tungsten Carbide Core Ring with Magnetic Permeability <1.002 and Residual Magnetization <0.05 mT Made from 100% Virgin Material

Szczegóły Produktu:
Miejsce pochodzenia: Zhuzhou, Chiny
Nazwa handlowa: Sanxin
Numer modelu: SX1267
Zapłata:
Minimalne zamówienie: 2
Czas dostawy: 5-25 dni
Zasady płatności: T/T, Western Union, L/C.
  • Szczegóły informacji
  • opis produktu

Szczegóły informacji

Funkcja: Odporne na zużycie Odporność chemiczna: Odporny na większość kwasów i zasad
Stosowanie: Cięcie i wiercenie wymiar: Dostosowywanie
Obróbka powierzchniowa: Zwykły, pusty, spiekany Spa-życie: Długi
Stabilność chemiczna: Wysoki Materail: 100% oryginalny materiał
Kraj pochodzenia: CHINY Standard: ISO, RoHS
Podkreślić:

Magnetic Permeability <1.002 Tungsten Carbide Core Ring

,

100% Virgin Material WC-Ni Core Ring

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Residual magnetization <0.05 mT Non-magnetic Tungsten Carbide Core Ring

opis produktu

Special Anti-interference Material Non-magnetic Tungsten Carbide Core Ring
μ-grade non-magnetic tungsten carbide core ring with magnetic permeability of <1.002
When precision measurement encounters magnetic field interference, this non-magnetic core ring provides the ideal solution. Precision-manufactured using nickel-bonded tungsten carbide (WC-Ni) with a special demagnetization process, it eliminates magnetic interference issues associated with traditional tungsten steel parts. Ensures zero magnetic interference, high precision, and long-life stable operation in magnetic field-sensitive environments.
Non-Magnetic Principle: A Breakthrough in Materials Science
  • Non-Magnetic Mechanism:
    • Nickel-based binder phase replaces traditional cobalt phase
    • Magnetic permeability controlled to <1.002
    • Residual magnetization <0.05 mT
  • Matrix material: 90% WC + 10% Ni, non-magnetic formula
  • Hardness: 92 HRA (Vickers hardness 1800 HV)
  • Density: 14.8-15.1 g/cm³
  • Resistivity: 0.8-1.2 μΩ*m
Applications
Consumer Electronics Manufacturing
  • Mobile phone camera module soldering
  • Micro connector soldering
  • TWS earphone component soldering
Semiconductor Packaging
  • BGA chip packaging soldering
  • CSP chip-scale packaging
  • Wafer-level soldering
Automotive Electronics
  • Automotive sensor soldering
  • ECU control unit soldering
  • In-vehicle camera modules
Medical Electronics
  • Medical sensor soldering
  • Implantable device packaging
  • Diagnostic device manufacturing
Product Specifications
Parameter Type Specification Value Accuracy Standard
Nominal Aperture 450µm ±1µm
Aperture Circularity ≤0.5µm (inspected by industrial endoscope)
Flow Channel Roughness Ra ≤0.1µm (certified by white light interferometry)
Material Hardness 91.5 HRA (Rockwell hardness tester)
Heat Deflection ≤0.001mm/100°C (tested by thermal expansion tester)
The above data is for reference only. Customization is possible upon request.
Non-magnetic Tungsten Carbide Core Ring with Magnetic Permeability <1.002 and Residual Magnetization <0.05 mT Made from 100% Virgin Material 0

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